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hanwhaKester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces. Kester was founded in 1899 as the Chicago Solder Company to produce flux‐cored solder. This patented Kester manufacturing process has had a major impact in the electronics industry to this day.

Kester has innovated in step with the evolving electronics market by supplying VOC‐free wave fluxes for through hole in the 70’s, solder paste during the adoption of SMT technology in the 80’s, leadfree alloys during the 90’s and 2000’s, and halogen‐free during 10’s.

Kester recognized the importance of being a global supplier in the electronics industry by establishing manufacturing facilities in Singapore (1969), Germany (1972), Japan in (1999), China in (2014) to better service the Asian and European markets, respectively.

Kester offers the following solutions:

  • Solder Wire
  • Solder Paste
  • Liquid Solder Flux
  • Tacky Solder Flux (TSF)
  • Preforms
  • SE‐CURE™ Advanced Materials for Semiconductor Packaging
  • Bar Solder
  • A full spectrum of global customer technical support



275 Flux‐Cored Wire

Kester 275 No‐Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 No‐Clean Flux results in an extremely clear postsoldering residue without cleaning. The unique chemistry in 275 was also designed to reduce spattering common to most core fluxes. 275 can be used for both lead‐free and leaded soldering. 275 is classified as ROL0 per J‐STD‐004.



kester2x245 Flux‐Cored Wire

Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. 245 is classified as ROL0 per J‐STD‐004. 245 is Bellcore GR‐78 compliant.




Kester SELECT‐10™ is a zero‐halogen, no‐clean liquid flux designed specifically for the needs of the selective soldering process. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. Specific to selective soldering, SELECT‐10™ does not spread beyond the spray pattern and will not clog the fluxer head. SELECT‐10™ residues are non‐tacky for improved cosmetics. SELECT‐10™ is classified as ROL0 flux under IPC J‐STD‐004B. SELECT‐ 10™ is part of Kester’s high reliability product line and compatible with no‐clean NP505‐HR Solder Paste, NF372‐TB Solder Flux and RF550 Refwork Flux. SELECT‐10™ is also available as a flux‐pen.

kester4NF372‐TB Soldering Flux

Kester NF372‐TB is a zero‐halogen, no‐clean, low solids liquid flux designed to be used in wave and hand soldering processes. It can be used with both leaded and lead‐free alloys. One of its best features is the ability to withstand long dwell times and high preheat temperatures needed in thick board assemblies. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. NF372‐TB residues are minimal, clear and non‐tacky for improved cosmetics. NF372‐TB is classified as ROL0 flux under IPC JSTD‐ 004B. NF372‐TB Solder Flux is part of Kester’s high reliability product line and compatible with no‐clean NP505‐HR Solder Paste, RF550 Rework Flux and SELECT‐10™ Selective Soldering Flux.

kester5985M Soldering Flux

Kester 985M is a low solids, halide‐free, no‐clean flux that is designed for wave solder, selective solder and touch up processes. 985M was developed for use with both traditional tin‐lead and lead‐free solder alloys. 985M exhibits improved soldering performance to minimize solder bridges (shorts) during all soldering operations. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. As tested under J‐STD‐004A specifications 985M is classified Type ROL0.

kester6959T Soldering Flux

Kester 959T is a no‐clean, non‐corrosive, liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. 959T was developed to minimize the formation of micro‐solderballs during wave soldering operations. This flux contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. 959T offers the best wetting and the shiniest solder joints of any no‐clean, solvent‐based chemistry. 959T leaves evenly distributed residues for the best cosmetic appearance.

kester7979VT Soldering Flux

Kester 979VT is a VOC‐free, no‐clean flux formulation for high quality, low‐defect soldering of lead‐free electronic circuit board assemblies. This flux€™s finely tuned activation system offers the best wetting available in VOC‐free liquid flux technology and the shiniest solder joints. 979VT also reduces micro‐solderballing on glossy and matte laminates and between connector pins. 979VT will not attack properly cured solder masks or FR‐4 Epoxy‐Glass laminate. It has been specially formulated to accommodate needs of single sided board assemblers. 979VT leaves no haze or visible residue behind, including the white powdery residue associated with use of earlier no‐clean formulas. The miniscule amount of non‐visible residue that remains after soldering is non‐conductive, non‐corrosive, and does not need to be removed.

kester8186 Soldering Flux

Kester 186, under MIL‐F‐14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue after soldering is non‐corrosive and non‐conductive. 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. This flux possess high thermal stability for soldering multi‐layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.



kester9NP545 Solder Paste

Kester NP545 is a zero‐halogen, lead‐free, no‐clean solder paste formula designed for consistency and repeatability. NP545 is extremely stable and has an unrefrigerated shelf life of 12 months with no print or solderability degradation. NP545 consistently delivers paste transfer efficiencies of 0.55 to 0.5AR. The paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NP545 is classified as ROL0 per IPC J‐STD‐004B.

kester10NP505‐HR Solder Paste

Kester NP505‐HR is a zero‐halogen, lead‐free, no‐clean solder paste formula developed specifically for high reliability applications. NP505‐HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505‐HR can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures and humidities. NP505‐HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping behavior. Post‐soldering, the NP505‐HR offers minimized defects, including head‐in‐pillow and QFN/BGA voiding. This paste is zero‐halogen, exceeding the IPC definition for halogen‐free. NP505‐HR is classified as ROL0 per IPC J‐STD‐004B. NP505‐HR is part of Kester’s high reliability product line and compatible with no‐clean RF550 Rework Flux, NF372‐TB Solder Flux and SELECT‐10™ Selective Soldering Flux.

kester11NXG1 Solder Paste

Kester NXG1 is a lead‐free, no‐clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead‐free alloys. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J‐SDTD‐005 compliant. The flux as per IPC ANSI/J‐STD‐004B is classified ROL1.

kester12R276 Solder Paste

Kester R276 is a no‐clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.



kester13Kester brings over 50 years of experience in preform manufacturing and can provide preforms in a variety of shapes, sizes, and flux types. Preforms can provide a precise volume of solder and flux to the right area at the right time for a number of different applications. The main applications include, but are not limited to, die attach, vacuum and hermetic seals and gaskets, PCB solder fortifications, connector pins and component attach, mechanical attachment, and thermal fuses. View the tables below to determine what sizes and flux types Kester offers and call a local sales representative today to inquire about technical questions and sample requests.




Kester TSF‐6852 is a synthetic water‐soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typically found in fluxes. This maximizes lot‐to‐lot consistency. TSF‐6852 is room temperature stable and does not require refrigeration for long‐term storage. This reduces production line space for material storage and the cost of refrigerated storage. TSF‐6852 has been formulated to be a drop in replacement for a variety of metallurgies. These include low melting point alloys (SnBi, SnBiAg, etc.), typical tin‐lead eutectic alloys and the higher melting point, lead‐free alloys (SnAg, SnCu, SnAgCu, SnSb, etc.). Post reflow, the residues are completely soluble in water and do not require any cleaning additives. To reduce the cost of assembling, room temperature or cool water (<65ºC) can be used to remove TSF‐6852 residues.



kester15K100LD Lead‐Free, Silver‐Free Alloy Bar Solder

K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead‐free alloy alternatives.

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